Gigabyte Z790 AORUS ELITE AX ICE gaming motherboards fully optimise the performance within the latest Intel 13th generation processors with our most capable digital power design ever. Before you would notice, the heat generated from the beastly power consumption is already dealt with by the full metal thermal solution. Not to mention the lightning-fast track to the next-gen PCIe 5.0 and the top-tier compatibility of DDR5 memory. Be crowned the king of gaming.
Specifications
- Chipset: Intel Z790
- CPU Socket: LGA1700
- Supported CPU: Intel 12th,13th & 14th Gen
- Memory Slots: 4
- PCIe Gen 5 X16 Slots: 1
- Form Factor: ATX
- Twin 16+1+2 Phases Digital VRM Solution
- Next Generation Storage
- Advanced Thermal Design & M.2 Thermal Guard III
- 2.5GbE LAN & Wi-Fi 6E 802.11ax
- DP, HDMI, Front USB-C 10Gb/s, Rear USB-C 20Gb/s
- Smart Fan 6
Intel Z790
Chipset
LGA1700
Socket
Gen 5.0
PCIe
ATX
Form Factor
About the Gigabyte Z790 AORUS ELITE AX ICE Motherboard
Memory, to the Future
All AORUS series gaming motherboards feature multiple techniques to enhance the performance of DDR5 memory with the best compatibility.
Overall Thermal
Every Gigabyte Z790 AORUS ELITE AX ICE motherboard is armoured with the most advanced, full metal thermal design. These solid heatsinks are forged to keep your system cool while running fast.
Build Effortless
Building your own PC is meant to be joyful and effortless. AORUS serious motherboard the most DIY-friendly ever.
Versatile Connectivity
Enable the ultimate connection experience with blazing data-transfer speeds through the next generation network, storage, and Wi-Fi connectivity.
Wi-Fi 6E
Wi-Fi 6E enhances VR with faster speeds, lower latency, increased capacity, and stronger security, enabling seamless wireless streaming of high-quality VR games and improved multi-user experiences.
High Quailty Sound
Enjoy a high-quality sound experience, which supports 7.1 channel playback, features an advanced microphone array, and offers versatile connectivity options for gaming and entertainment.
VRM Thermal Armour Advanced
High coverage MOSFETs and integrated molded heatsinks improve thermal efficiency by enhancing airflow and heat exchange.
